英國一家研發(fā)中心尋找設(shè)計和制造超聲相控陣傳感器的合作伙伴
英格蘭東部一家研發(fā)中心的PF7項目正在尋找合作伙伴。這個項目意在研發(fā)一種超聲波技術(shù)以確認(rèn)在分層結(jié)構(gòu)中的擴(kuò)散接合程度。合作伙伴將會參與到超聲相控陣傳感器的研發(fā)過程。
擴(kuò)散接合技術(shù)將造福于眾多工業(yè)部門和應(yīng)用部門，尤其是需要將不同異質(zhì)材料接合起來的行業(yè)。主要的有點在于，不同于焊接，擴(kuò)散接合并非是一個熔接過程，即初始材料將不需被熔融。這使得擴(kuò)散接合技術(shù)成為了可把不同材料接合起來的理想的技術(shù)。
技術(shù)要求：
尋找的中小企業(yè)合作伙伴需要參與超聲相控陣傳感器的開發(fā)。
項目目標(biāo)：針對中小企業(yè)進(jìn)行的研發(fā)項目
截止日期：2012年11月15日
項目縮寫：Bondtest
項目進(jìn)展：研發(fā)中
項目參與時間：2年
預(yù)計歐盟資金支持：待定
英文原文:
PS FP7 BondTest FP7 consortium seeks a partner involved in the design/manufacture of ultrasonic phased array sensors. (12 GB 4103 3Q24)
An FP7 project being developed by an East of England research centre requires a number of partners to complete the consortium. The project aims to develop an ultrasonic technique to characterise diffusion bonds in layered structures. An SME is required to help with the development of ultrasonic phased array sensors.
Diffusion bonding offers a number of advantages to a wide range of industry sectors and applications, particularly where there is a need to join dissimilar materials. The main advantage of diffusion bonding is that, unlike welding, it is not a 'fusion' process the parent materials to be joined do not need to be melted. This makes diffusion bonding an ideal solution for joining materials such as: " Metals " Ceramics
Technical Specifications / Specific technical requirements:
An SME partner is required to assist in the development of the ultrasonic phased array sensors.
Call targeted: FP7 Research for SMES
Call deadline: 15/11/2012
Deadline for Partner Search: 30/09/2012
Project Acronym: Bondtest
Proposal development stage: Proposal under development
Anticipated project duration: 2 years
Total EU funding anticipated: To be confirmed
